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| BLOCK COMPONENTS |
| Min/Max. Disk Drives |
6 à 50 (single controller) and 100 (dual controller) |
| Array Enclosure |
Single or dual processor ; 2U |
| Drive Enclosure Options |
12 x 3.5” SAS/NL SAS drives (2U) and 25 x 2.5" Flash/SAS (2U) |
| RAID Options |
10/5/6 |
| CPU/Memory per Array |
Single processor : 1 x Xeon Quad Core/4 GB. Dual processor : 2 x Xeon Quad Core/8 GB |
| Max Block Flex IO Modules per Array |
1 |
| Embedded IO Ports per Array |
2 x 1 Gb/s IP per processor |
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| FUNCTIONNAL LIMITS |
| Max SAN Hosts |
128 |
| Max Number of LUNs |
Single processor : up to 128. Dual processor : up to 256 |
| Max LUN Size |
2 TB |
| Max File System Size |
16 TB |
| OS Support |
Microsoft Windows Server 2003, Microsoft Windows Server 2008, Windows Server 2008 R2+, Microsoft Windows 7 and Vista, Microsoft Hyper-V, VMware® ESX®, RedHat Enterprise Linux, Novell Suse Enterprise Linux, Solaris 10 SPARC (1) |
| | |
| VNX CONNECTIVITY |
| File FLEX IO Module |
Copper 10/100/1000 Base T 1 Gb/s and 10 Gb/s Ethernet |
| Management |
LAN 2 x 10/100/1000 Copper GbE |
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| DRIVES SUPPORTED |
| 3.5" HDD SAS 15Krpm |
300 GB, 600 GB |
| 3.5" HDD SAS 10Krpm |
300 GB, 600 GB, 900 GB |
| 2.5" HDD SAS 10Krpm |
300 GB, 600 GB, 900 GB |
| 3.5" HDD NL (Near Line) 7.2Krpm |
1 TB, 2 TB, 3 TB |
| 2.5" SDD SAS |
100 GB and 200 GB |
| | CIFS; NFS; iSCSI; NLM; RIP; SNMP; NDMP; ARP; ICMP; SNTP; LDAP |
| | |
| VNX SOFTWARE |
| Management Software |
Unisphere |
| Base Software |
Automated Volume Management (AVM): File system provisioning ; Thin Provisioning: Enables logical sizing and physical provisioning ; VNXe Deduplication and Compression: File-based deduplication with compression |
| Software Suites |
Application Protection; Remote Protection; Security and Compliance |
| Software Packs |
Total Value Pack includes the software suites : Application Protection; Remote Protection; Security and Compliance |
| | |
| PHYSICAL SPECIFICATIONS |
| Size (HxWxD) |
| º Processor Enclosure |
3.40 in. x 17.5 in. x 20.0 in./ 8.64 cm x 44.45 cm x 50.8 cm |
| º Expansion Enclosure |
3.40 in. x 17.5 in. x 20.0 in./ 8.64 cm x 44.45 cm x 50.8 cm |
| Weight |
| º Processor Enclosure |
Drive 3.5": 60.5 lb/26.4 kg / Drive 2.5" :48 lb/ 21.8 kg |
| º Expansion Enclosure |
Drive 3.5": 52.0 lb/23.6 kg / Drive 2.5" : 38.35 lb/ 17.4 kg |
| | |
| ENVIRONMENT |
| Temperature |
50–104 degrees F (10–40 degrees C), |
| Temperature Gradient |
19 degrees F/hr (10 degrees C/hr) |
| Humidity |
20% to 80% (non-condensing) |
| Altitude |
8,000 ft (2,438 m) @ 104 degrees F (40 degrees C) max, 10,000 ft (3,048 m) @ 98.6 degrees F (37 degrees C) max |
| | |
| POWER |
| Input Voltage |
100 to 240 VAC ± 10%, single-phase, |
| Frequency |
47 to 63 Hz |
| Power consumption |
| º Processor Enclosure |
395 VA (380 W) max |
| º Expansion Enclosure |
250 VA (240 W) max |
| Heat Dissipation |
| º Processor Enclosure |
1,300 Btu/hr max |
| º Expansion Enclosure |
820 Btu/hr max |
| | |
| REGULATORY & SAFETY |
| Safety |
UL 60950; CSAC 22.2-60950, FN 60950, Manufactured under an ISO 9000-registered quality system, ETSI EN 300 386 |
| Electromagnetic Compatibility (EMC) |
FCC Class A EN55022 Class A, CE Mark VCCI Class A (for Japan), ICES-003 Class A (for Canada) AS/NZS 3548 Class A (for Australia/New Zealand), EN55024 Immunity, ITE BSMI Class A (for Taiwan) |
| | |
| WARRANTY |
| Standard warranty |
World Wide; 3 years Hardware Support, 9x5, Next Business Day, parts only, Customer in charge of replacement |
| Extended Warranty |
Bull’s GlobalCare offer: Bronze, Silver, Gold levels; depends on location |
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| NOTES |
| Note 1 |
(1) See the interoperability matrix of EMC |
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