| | |
| BLOCK COMPONENTS |
| Min/Max. Disk Drives |
6 to 150 |
| Array Enclosure |
Dual processor ; 3U |
| Drive Enclosure Options |
15 x 3.5” SAS/NL SAS/Flash drives–3U and 25 X 2.5" SAS / Flash 2U |
| RAID Options |
10/5/6 |
| CPU/Memory per Array |
2 x Xeon Quad Core/24 GB |
| Max Block Flex IO Modules per Array |
2 |
| Embedded IO Ports per Array |
4 x 1 Gb/s IP per processor |
| | |
| FUNCTIONNAL LIMITS |
| Max SAN Hosts |
256 |
| Max Number of LUNs |
Up to 512 |
| Max LUN Size |
2 TB |
| Max File System Size |
16 TB |
| OS Support |
Microsoft Windows Server 2003, Microsoft Windows Server 2008, Windows Server 2008 R2+, Microsoft Windows 7 and Vista, Microsoft Hyper-V, VMware® ESX®, RedHat Enterprise Linux, Novell Suse Enterprise Linux, Solaris 10 SPARC (1) |
| | |
| VNX CONNECTIVITY |
| File FLEX IO Module |
Copper 10/100/1000 Base T 1 Gb/s, Optical 10 Gb/s Ethernet |
| Management |
LAN 2 x 10/100/1000 Copper GbE |
| | |
| DRIVES SUPPORTED |
| 3.5" HDD SAS 15Krpm |
300 GB, 600 GB |
| 3.5" HDD SAS 10Krpm |
900 GB |
| 2.5" HDD SAS 10Krpm |
300 GB, 600 GB and 900 GB |
| 3.5" HDD NL (Near Line) 7.2Krpm |
1TB, 2 TB and 3 TB |
| 3.5" SDD SAS |
100, 200 GB |
| 2.5" SDD SAS |
100, 200 GB |
| | CIFS; NFS; iSCSI; NLM; RIP; SNMP; NDMP; ARP; ICMP; SNTP; LDAP |
| | |
| VNX SOFTWARE |
| Management Software |
Unisphere |
| Base Software |
Automated Volume Management (AVM): File system provisioning ; Thin Provisioning: Enables logical sizing and physical provisioning ; VNXe Deduplication and Compression: File-based deduplication with compression |
| Software Suites |
Local Protection; Application Protection; Remote Protection; Security and Compliance |
| Software Packs |
Total Protection Pack includes the software Suites : Local Protection; Application Protection; Remote Protection; Security and Compliance |
| | |
| PHYSICAL SPECIFICATIONS |
| Size (HxWxD) |
| º Processor Enclosure |
5.25 in. x 17.5 in. x 24.0 in./13.3 cm x 44.5 cm x 61.0 cm |
| º Expansion Enclosure |
5.25 in. x 17.5 in. x 14.0 in./13.34 cm x 44.5 cm x 35.56 cm |
| Weight |
| º Processor Enclosure |
96.4 lb/43.8 kg |
| º Expansion Enclosure |
72 lb/32.66 kg |
| | |
| ENVIRONMENT |
| Temperature |
50–104 degrees F (10–40 degrees C) |
| Temperature Gradient |
19 degrees F/hr (10 degrees C/hr) |
| Humidity |
20% to 80% (non-condensing) |
| Altitude |
8,000 ft (2,438 m) @ 104 degrees F (40 degrees C) max, 10,000 ft (3,048 m) @ 98.6 degrees F (37 degrees C) max |
| | |
| POWER |
| Input Voltage |
100 to 240 VAC ± 10%, single-phase, |
| Frequency |
47 to 63 Hz |
| Power consumption |
| º Processor Enclosure |
480 VA (455 W) max |
| º Expansion Enclosure |
280 VA (235 W) max |
| Heat Dissipation |
| º Processor Enclosure |
1,560 Btu/hr max |
| º Expansion Enclosure |
800 Btu/hr max |
| | |
| REGULATORY & SAFETY |
| Safety |
UL 60950; CSAC 22.2-60950, FN 60950, Manufactured under an ISO 9000-registered quality system, ETSI EN 300 386 |
| Electromagnetic Compatibility (EMC) |
FCC Class A EN55022 Class A, CE Mark VCCI Class A (for Japan), ICES-003 Class A (for Canada) AS/NZS 3548 Class A (for Australia/New Zealand), EN55024 Immunity, ITE BSMI Class A (for Taiwan) |
| | |
| WARRANTY |
| Standard warranty |
World Wide; 3 years Hardware Support, 9x5, Next Business Day, parts only, Customer in charge of replacement for some components |
| Extended Warranty |
Bull’s GlobalCare offer: Bronze, Silver, Gold levels; depends on location |
| | |
| NOTES |
| Note 1 |
(1) See the interoperability matrix of EMC |
| |
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